Robust photopolymers for MCM, board, and backplane optical interconnectsELDADA, L; NAHATA, A; YARDLEY, J. T et al.SPIE proceedings series. 1998, pp 175-191, isbn 0-8194-2727-6Conference Paper

Polyimide optical waveguide with multi-fan-out for multichip module systemMATSUMOTO, T; KUWANA, Y; HIROSE, A et al.SPIE proceedings series. 1998, pp 133-144, isbn 0-8194-2727-6Conference Paper

Experimental demonstration of a multi-channel micro-optical bridge for multi-Gb/s, free-space intra-MCM interconnectsVERSCHAFFELT, G; BUCZYNSKI, R; GENOE, J et al.SPIE proceedings series. 1998, pp 44-47, isbn 0-8194-2949-XConference Paper

Guided-wave optoelectronic clock distribution networks on multichip modules using MEMS fabrication techniquesSEUNGUG KOH; SUH, S.-D; DANJIN WU et al.SPIE proceedings series. 1998, pp 79-84, isbn 0-8194-2727-6Conference Paper

A 160Gb/s interface design configuration for multichip LSIEZAKI, Takayuki; KONDO, Kazuhiro; OZAKI, Hiroshi et al.IEEE International Solid-State Circuits Conference. 2004, pp 140-141, isbn 0-7803-8267-6, 2Vol, 2 p.Conference Paper

Dual-block assembled microelectronics tactile sensorGANDELLI, A; LAZZARONI, M; OTTOBONI, R et al.SPIE proceedings series. 1997, pp 203-208, isbn 0-930815-50-5Conference Paper

Technology insertion and process improvements : A case studySPRECKELS, C; GREEN, T. J.SPIE proceedings series. 1997, pp 551-556, isbn 0-930815-50-5Conference Paper

Boundary-scan test system based on VXI busDU, Ying; ZHAO, Wenyan; XI, Quansheng et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, pp 63581P.1-63581P.6, issn 0277-786X, isbn 0-8194-6453-8, 2VolConference Paper

Laser-based electro-optic testing of multichip module structuresMECHTEL, D. M; CHARLES, H. K; FRANCOMACARO, A. S et al.Microelectronics and reliability. 1998, Vol 38, Num 12, pp 1847-1853, issn 0026-2714Article

Efficient waveguide couplers using tilted gratings for optoelectronic interconnectsJIANHUA GAN; BIHARI, B; LINGHUI WU et al.SPIE proceedings series. 1998, pp 122-132, isbn 0-8194-2727-6Conference Paper

A discussion of integrated circuit (IC), MultiChip Module (MCM), and MEMS applications fabricated through MOSISPELTIER, J; HANSFORD, W.SPIE proceedings series. 1997, pp 25-33, isbn 0-8194-2680-6Conference Paper

Implementing high performance graphics subsystems with complex IC technologyBEAT, S. W; AVERY, G; BROWN, S. K et al.SPIE proceedings series. 1997, pp 500-505, isbn 0-930815-50-5Conference Paper

A 1.2Gb/s/pin wireless superconnect based on inductive inter-chip signaling (IIS)MIZOGUCHI, Daisuke; YUSMEERAZ BINTI YUSOF; MIURA, Noriyuki et al.IEEE International Solid-State Circuits Conference. 2004, pp 142-143, isbn 0-7803-8267-6, 2Vol, 2 p.Conference Paper

AIDE A LA CONCEPTION DE SYSTEMES TESTABLES = COMPUTER AIDED DESIGN OF TESTABLE SYSTEMSMaroufi, Walid; Marzouki, Meryem.1999, 182 p.Thesis

The integration of electroluminescent displays on multilayer ceramic-on-metal circuit boards for application in military vehiclesRIDDLE, G. H. N; SREERAM, A. N; STAEBLER, D. L et al.SPIE proceedings series. 1998, pp 264-268, isbn 0-8194-2812-4Conference Paper

Large-area, high-throughput, high-resolution lithography systems for flat-panel displays and microelectronic modulesJAIN, K; DUNN, T; FARMIGA, N et al.SPIE proceedings series. 1998, pp 197-206, isbn 0-8194-2776-4Conference Paper

Performance simulations of optical multi-chip-module interconnects : Comparing guided-wave and free-space pathwaysBAUKENS, V; VERSCHAFFELT, G; BAETS, R et al.SPIE proceedings series. 1998, pp 412-415, isbn 0-8194-2949-XConference Paper

Advanced T/R module packaging for active phased array antennasPILOTO, A; STRACK, D; FERRELL, G et al.SPIE proceedings series. 1997, pp 326-331, isbn 0-930815-50-5Conference Paper

Cost-effective multichip module manufacture using passive substrate fault tolerancePEACOCK, C; BOLOURI, H; HABIGER, C et al.IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1997, Vol 20, Num 3, pp 320-326, issn 1070-9894Conference Paper

New process monitoring strategies for large area panel processingCOTTET, Didier; SCHEFFLER, Michael; TRÖSTER, Gerhard et al.SPIE proceedings series. 2000, pp 166-171, isbn 0-930815-62-9Conference Paper

New method for grafting a thin film metal-semiconductor-metal photodetector with a transimpedance amplifier and applications to multichip module packagingMORRISON, C. B; ZHENG ZHU; STEINBERG, J et al.SPIE proceedings series. 1998, pp 16-22, isbn 0-8194-2727-6Conference Paper

Thermal model reduction for IC packages and MCM'sFURMANCZYK, M; NAPIERALSKI, A; YU, E et al.THERMINIC : international workshop on thermal investigations of ICs and microstructures. 1998, pp 135-138, isbn 2-913329-01-2Conference Paper

Design and fabrication of optoelectronic multichip module prototypes using MEMS fabrication techniquesKOH, S; SADLER, D. J; OH, K et al.SPIE proceedings series. 1997, pp 43-51, isbn 0-8194-2419-6Conference Paper

Large area Processing (LAP) : Performance studies on extrusion coatingWELLS, G. T; GIBSON, G; NEWQUIST, C et al.SPIE proceedings series. 1997, pp 54-59, isbn 0-930815-50-5Conference Paper

Electronic alignment for proximity communicationDROST, Robert; HO, Ron; HOPKINS, David et al.IEEE International Solid-State Circuits Conference. 2004, pp 144-145, isbn 0-7803-8267-6, 2Vol, 2 p.Conference Paper